CML Micro

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Board Ref		PCB653A
Date			26\03\2021
PCB Construction	2 Layer Plated Through and Copper Filled Vias

Gerber Files
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CNP2CD01_PCB_Bot.gbr				Bottom layer pattern - ground plane 
CNP2CD01_PCB_Comp.gbr				Component positions (for information only)
CNP2CD01_PCB_Outline.gbr			PCB outline (for routing)
CNP2CD01_PCB_SilkScreen.gbr			Silk Screen - top layer (white LPI)
CNP2CD01_PCB_Solder_Resist_top.gbr		Solder Resist - top layer (negative - Green LPI)
CNP2CD01_PCB_Solder_Stencil.gbr			Solder Stencil - top layer SMT pad size apertures (for information only)
CNP2CD01_PCB_Top.gbr				Top layer pattern

Pattern dimensions to be as indicated in gerber files
Top and bottom layer copper to be finished as immersion silver
Final metal thickness to be nominal 50um
Gerber files in RS274-X format

Drill File
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CNP2CD01_PCB_Via_NPTH.drl	Non plated through vias (4 off 3.175mm diam for alignment dowels)
CNP2CD01_PCB_Via_PTH.drl	Plated through holes (4 off 2.2mm diam; 8 off 0.84mm diameter)
CNP2CD01_PCB_Via_SolidCu.drl	Solid copper filled vias, overplated and planarised (546 off 0.15mm diameter)

Hole diameters are drill diameter/size

Board
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Rogers RO4003 8thou thick 1/2oz DS copper
PCB size is 26mm x 46mm
Origin lower left corner
Width of main (GCPW) RF track and gap 0.33mm and 0.21mm respectively
Minimum track width and gap is approx 0.15mm and 0.15mm respectively
Minimum metal to edge spacing 0.05mm
